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confidential ? page : 1 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. wismo quik q268 6 process customer guidelines reference : wm_prj_Q2686_pts_004 revision : 003 date : 08 th february 2006
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 2 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. document information revision date history of the evolution 001 02/09/05 creation 002 24/11/0 5 move from Q2686f to Q2686h 003 08/02/06 add of imp connector
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 3 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. contents document information ................................ ................................ ....... 2 contents ................................ ................................ ............................ 3 caution ................................ ................................ .............................. 5 trademarks ................................ ................................ ........................ 5 overview ................................ ................................ ............................ 6 1. storage condition ................................ ................................ ........ 7 2. products packaging and labeling ................................ ................. 7 2.1 packaging elements ................................ ................................ ................ 7 2.1.1 3. caution ................................ ................................ ..................... 14 3.1 handling ................................ ................................ ............................... 14 4. assembly process ................................ ................................ ...... 15 4.1 general ................................ ................................ ................................ .. 15 4.2 lead - free process ................................ ................................ .................. 15 4.3 rf connection ................................ ................................ ....................... 16 4.3.1 ufl/sma connector ................................ ................................ ....... 16 4.3.2 coaxial cable on the back side of the wireless cpu ....................... 17 4.3.3 imp connector ................................ ................................ ............... 19 4.4 100 leads connector process insertion ................................ .................. 20 4.5 solde ring of the legs ................................ ................................ .............. 21 4.5.1 recommended equipment ................................ ............................. 21 4.5.2 hand soldering ................................ ................................ .............. 22 4.6 acceptance criteria ................................ ................................ ................ 23
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 4 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 5. rework and wireless cpu exchange processes .......................... 24 5.1 general ................................ ................................ ................................ .. 24 5.2 procedure ................................ ................................ .............................. 24 5.2.1 equipment recommended ................................ .............................. 24 5.2.2 process ................................ ................................ .......................... 24 5.3 acceptance criteria ................................ ................................ ................ 25 5.4 solder new wireless cpu ................................ ................................ ...... 25 appendixes ................................ ................................ ...................... 26
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 5 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. caution information furnished herein by wavecom is accurate and reliable. however no responsibility is assumed for its use. general information about wavecom and its range of products is available at the following internet address: http:// www.wavecom.com trademarks some mentioned products are registered trademarks of their respective companies.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 6 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. overview this document gives guidelines for the industrial assembly of a wismo quik Q2686 wireless cpu on an application. the product concerned is the following: ? Q2686 : egsm/gprs class 10 850/900/1800/1900 mhz with 32 mb of flash memory and 8 mb of psram (32/8)
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 7 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 1. storage condition wireless cpu can be stored in the following condition: - 40c to +85 c during 1 year. 2. products packaging and labeling wavecom wismo quik Q2686 are shipped in a box (inner package) which contain 100 produ cts (5 lines of 20 products ). 2.1 packaging elements 2.1.1 specifications : material :
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 8 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 2.1.2 outer package specification : material : double wall (or double - face) corrugated brown carton (three sheets of linerboard with two mediums in between) type : fefco 02 01 dimension : 4 4 0 * 3 1 0 * 154 capacity : 6 pizza boxes (2x3) this packaging is stamped with resy specification. the dimension is defined to be filled with boxes without any empty space figure 3 design of collective packagin g 2.1.3 eur pallet specification: weight: 22 kg dimensions: 1200mm x 800mm x 150 mm capacity: from 3 to 12 cartons weight loaded: up to 350 kg
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 9 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 2.1.4 strap specification : material: polypropylene. width : minimum 08 mm. 2.1.5 shrink plastic specification : material : polyethylene. type : shrinked plastic bag. dimension : at least 20 micron 2.2 summary of recyclable elements packaging elements recyclable inner package yes outer package yes
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 10 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 2.3 product label specifications this specification is given for information only. wavecom may, at any time and without notice, make changes to the label. h variable 3 variable 1 b c w variable 2 a
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 11 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. wismo Q2686 labeling layout w: 29mm (max) h: 20mm (max) material : polyester notes : the maximum temperature supported by the label is 100c variable 1 product reference variable 2 tracking number specification a b c rf test bench id production site id format 3 digits 0 - xxx blank or 2 digits 0 - 99 ex. 136 blank for wm internal product type unit of the year week chronological number numeric test bench id pcb version + part - list retrofit version forma t 2 digits 0 - 99 1 digit 0 - 9 2 digits 1 - 53 5 digits 0 - 99999 2 digits 0 - 3 2 3 digits (xxx) 0 - 999 2 digits (xx) 0 - 99 ex. 54 for q2406 - c 3 for y.2003 01 00170 01 401 for hw version v401 01 (v401, no retrofit) 17 digits encoded in the bar code digits printed but not encoded in the bar code
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 12 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. variable 3 es (engineering sample) pp (pre - production) 2.3.1 inner packaging 70 list of serial numbers of products complete marketing reference + custom reference + hardware version internal reference (5 digits) software code (4 digits) software version options (32 characters max.) quantity of products in the box box serial number on 14 digits : mm : manufacturing plant ttt : product type y : last figure in the year in progress ww : week in progres s pp : packaging bench number bbbb : chronological number in the week Q2686h
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 13 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 2.3.2 outer packaging complete se rial numbers of boxes of lower level logistic units (manufacturing boxes for outer boxes and outer boxes for pallets) complete marketing reference + custom reference + hardware version outer box serial number on 14 digits : mm : manufacturing plant ttt : product type y : last figure in the year in progress ww : week in progress pp : packaging bench number bbbb : chronological number in the week information on products and boxes inside the outer box (or pallet) Q2686h
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 14 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 3. caution 3.1 handling wismo quik Q2686 are esd sensitive (voltage < 1kv) esd ground equipments (ta bles and shelves) ? no plastic bags ? esd chairs ? avoid any non - useful material ? wear cotton blouse (avoid any synthetic blouse) ? wear esd shoes or heel stapes ? when seated, wear wrist strap ? before entering an esd area, check the discharge and if necessary evacuate charge via the tester ? humidity standard ranges for humidity are between 30 and 70% rh ? t emperature standard ranges for temperature are between 5 and 45c ? handling wear gloves ? handle wismo quik based on ipc a610 refer ence chapter 3 ? soldering soldering reflow is forbidden ?
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 15 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 4. assembly process this section gives recommendations for the industrial assembly of the wireless cpu on the application. 4.1 general ? gloves must be worn when handling the cpu ? no cleaning of the c pu is allowed ? no warm air shall be blown on the cpu ? be careful not to damage the label of the cpu (warranty condition) 4.2 lead - free process according to the directive 2002/95/ce, wavecom banish the following hazardous substances: mercury (hg), lead (pb), cadm ium (cd), hexavalent chromium (cr+6), polybrominated diphenyl ether (pbde), polybrominated biphenyl (pbb). therefore, wavecom wireless cpu are : - with lead - free terminals and - with lead - free inner materials ( components and solder paste) therefore, the customer can have a lead - free customer application by using lead - free materials (lead - free smd solder paste, lead - free components and lead - free solder wire...) . but the wireless cpu is also mountable with a leaded process. but in this case, we recommend to use lead - free solder wires to guarantee that if wavecom cpu is removed, the cpu is still lead - free.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 16 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 4.3 rf connection there are three possibilities for rf connection ? via ufl/sma cable ? via coaxial cable ? via imp connector 4.3.1 ufl/sma connector the antenna can be c onnected to the wireless cpu through the ufl connector present on the wavecom cpu. ? insert the plug in the receptacle this step is done prior to the cpu mounting.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 17 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 4.3.2 coaxial cable on the back side of the wireless cpu the antenna can be connected to the cpu through a coaxial cable. the coaxial cable is connected to both the "rf pad" (or round pad) and the "ground pad". it is recommended to use a rg178 coaxial cable: o static curvature radius: 10mm o dynamic curvature radius: 20mm the cable must be soldered as described on the mechanical drawing in the following page: ? ? the antenna cable core must be soldered only once positioned in line with ? it is highly rec ommended to use a template to adjust the antenna cable to
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 18 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. figu re 1 : antenna cable connection the figure below describes the preparation and positioning of the cable.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 19 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 4.3.3 imp connector the antenna can be connected to the wireless cpu through an imp connector that must be assembled on the custom er board. the description of the contact pad on Q2686 cpu is described in the appendix. imp connector is fragile. special attention should be taken when handling the customer board in order to prevent any damage on it. ? no additional process step co ncerning mounting, assembly and handling of this component, please contact directly the supplier radiall. wavecom can not support the customer regarding the use of this connector.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 20 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 4.4 100 leads connector process insertion ? insert the wireless cpu connector in the motherboard connector until you hear a click by inserting the shielding leads in the trough - holes. the recommendations for these trough - holes are described in the appendix.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 21 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 4.5 soldering of the legs the legs of the wireless cpu shall be so ldered according to the following instructions: ? the type and size of connection holes shall be chosen according to wavecom recommendations (see layout requirement document and mechanical drawing in appendixes) ? the quality of the soldering, must be in acco rdance with the ipc - a - 610 rev - c chapter 6 soldering. class 2: general case class 3: for automotive. ? the figure bellow gives the cpu position before hand soldering, and caution for the Q2686. 4.5.1 recommended equipment ? soldering iron wsd80 (weller) or equiva lent (t max 385) o - solder wire : kester 245 cored 58 (sn96.5ag3cu0.5) or x39 60 - 40 (multi - core) ( snpb or snpbag ) diameter = 0.32 mm ? binocular type mantis (vision engineering) or equiv alent ? soldering tip type: lt1 (reference: 5 44 401 99)
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 22 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 4.5.2 hand soldering ? assemble the cpu in the customer application ? characteristic click can be heard ? on the opposite side solder the 4 legs ? turn the application board and solder the 3 accessible le gs on this side ? check with binocular the quality of the solder on both sides h
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 23 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 4.6 acceptance criteria ? the soldering quality must be in accordance with the ipc - a - 610 rev - c chapter 6 soldering. ? it must be no gap between wavecom product and the customer application ? excessive solder must be avoid in order not to damage the pcba or to prevent future repair . therefore, s older is only allowed at the lower - half of shielding belt (referring to fig - 1). half height of shielding belt
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 24 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 5. rework and wireless cpu exchan ge processes 5.1 general the cpu can be changed 3 times. the temperature of the iron must not exceed 385c. 5.2 procedure 5.2.1 equipment recommended ? unsoldering station dsea 4001 (sem) ? solder wick easy braid (no clean) ? rework flux: kester 952 - d6 5.2.2 process ? if using unsold ering station: fix the parameters of the unsoldering station o max temperature : 385 c o unsoldering pipe. inner diameter: 1mm ? if using solder iron : o max temperature : 385 c o same solder tip than for initial assembly ? unsolder the cpu leg by leg o put the unsold ering pipe or the solder iron on one leg. o wait a few seconds (5 to 10) until the solder is in fusion. o activate the aspiration while pushing on the pedal or use solder wick with solder iron. o be sure there is no solder left, else repeat the operation o repeat the operation for each leg. ? remove the cpu ? check there is no solder left and that the pads are ok. ? clean the pads, if necessary, with iron or solder wick.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 25 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. 5.3 acceptance criteria ? purpose : to ensure the rma wireless cpu returning from customers are in good co ndition and can be repaired in wm repair center. ? criteria : when removing Q2686 cpu from c ustomer application b oard, ensure that the belt is not unsoldered from the pcb and that the pcb is not deformed. 5.4 solder new wireless cpu see chapter 5.2.1
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 26 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable. appendixe s
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 27 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 28 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 29 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable.
wm_prj_Q2686_pts_004 - 00 3 8 th february 2006 confidential ? page : 30 / 30 this document is the sole and exclusive property of wavecom. not to be distributed or divulged without prior written agreement. ce document est la proprit exclusive de wavecom. il ne peut tre communiqu ou divulgu des tiers sans son autorisation pralable.

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